ADVANCED COMMUNICATIONS ARRAY
A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed cir...
Gespeichert in:
| Hauptverfasser: | , , , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | HERNDON, Mary K SIKINA, Thomas V WILDER, Kevin BENEDICT, James E SOUTHWORTH, Andrew R HAVEN, John P |
| description | A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4059092A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4059092A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4059092A13</originalsourceid><addsrcrecordid>eNrjZJB1dAlz9HN2dVFw9vf1DfXzdHYM8fT3C1ZwDApyjORhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASYGppYGlkaOhsZEKAEAWdsgxA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADVANCED COMMUNICATIONS ARRAY</title><source>esp@cenet</source><creator>HERNDON, Mary K ; SIKINA, Thomas V ; WILDER, Kevin ; BENEDICT, James E ; SOUTHWORTH, Andrew R ; HAVEN, John P</creator><creatorcontrib>HERNDON, Mary K ; SIKINA, Thomas V ; WILDER, Kevin ; BENEDICT, James E ; SOUTHWORTH, Andrew R ; HAVEN, John P</creatorcontrib><description>A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.</description><language>eng ; fre ; ger</language><subject>ADDITIVE MANUFACTURING TECHNOLOGY ; ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ; ANTENNAS, i.e. RADIO AERIALS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; TRANSPORTING</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220921&DB=EPODOC&CC=EP&NR=4059092A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220921&DB=EPODOC&CC=EP&NR=4059092A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HERNDON, Mary K</creatorcontrib><creatorcontrib>SIKINA, Thomas V</creatorcontrib><creatorcontrib>WILDER, Kevin</creatorcontrib><creatorcontrib>BENEDICT, James E</creatorcontrib><creatorcontrib>SOUTHWORTH, Andrew R</creatorcontrib><creatorcontrib>HAVEN, John P</creatorcontrib><title>ADVANCED COMMUNICATIONS ARRAY</title><description>A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.</description><subject>ADDITIVE MANUFACTURING TECHNOLOGY</subject><subject>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</subject><subject>ANTENNAS, i.e. RADIO AERIALS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJB1dAlz9HN2dVFw9vf1DfXzdHYM8fT3C1ZwDApyjORhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASYGppYGlkaOhsZEKAEAWdsgxA</recordid><startdate>20220921</startdate><enddate>20220921</enddate><creator>HERNDON, Mary K</creator><creator>SIKINA, Thomas V</creator><creator>WILDER, Kevin</creator><creator>BENEDICT, James E</creator><creator>SOUTHWORTH, Andrew R</creator><creator>HAVEN, John P</creator><scope>EVB</scope></search><sort><creationdate>20220921</creationdate><title>ADVANCED COMMUNICATIONS ARRAY</title><author>HERNDON, Mary K ; SIKINA, Thomas V ; WILDER, Kevin ; BENEDICT, James E ; SOUTHWORTH, Andrew R ; HAVEN, John P</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4059092A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>ADDITIVE MANUFACTURING TECHNOLOGY</topic><topic>ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING</topic><topic>ANTENNAS, i.e. RADIO AERIALS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HERNDON, Mary K</creatorcontrib><creatorcontrib>SIKINA, Thomas V</creatorcontrib><creatorcontrib>WILDER, Kevin</creatorcontrib><creatorcontrib>BENEDICT, James E</creatorcontrib><creatorcontrib>SOUTHWORTH, Andrew R</creatorcontrib><creatorcontrib>HAVEN, John P</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HERNDON, Mary K</au><au>SIKINA, Thomas V</au><au>WILDER, Kevin</au><au>BENEDICT, James E</au><au>SOUTHWORTH, Andrew R</au><au>HAVEN, John P</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADVANCED COMMUNICATIONS ARRAY</title><date>2022-09-21</date><risdate>2022</risdate><abstract>A communications array includes a support structure configured to array elements, and a plurality of array elements supported by the support structure. Each array element is fabricated from an advanced manufacturing techniques (AMT) process. The support structure may be fabricated from a printed circuit board (PCB) or similar dielectric material. Each array element may include a radiator and/or a beamformer manufactured using the AMT process. The communications array further may include a copper vertical launch (CVL) and/or an electromagnetic boundary.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP4059092A1 |
| source | esp@cenet |
| subjects | ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING ANTENNAS, i.e. RADIO AERIALS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING |
| title | ADVANCED COMMUNICATIONS ARRAY |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T21%3A03%3A44IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HERNDON,%20Mary%20K&rft.date=2022-09-21&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4059092A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |