EPOXY-MODIFIED SILICONE FINE PARTICLES AND METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION CONTAINING SAID FINE PARTICLES, AND SEALING MATERIAL

One of the purposes of the present invention is to provide silicone fine particles which do not aggregate in a thermosetting resin, while having softness derived from silicone rubber and having excellent adhesion with the thermosetting resin. The other purpose is to provide a method for preparing th...

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Bibliographische Detailangaben
Hauptverfasser:	INOKUCHI, Yoshinori, SAKAI, Mio
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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