EPOXY-MODIFIED SILICONE FINE PARTICLES AND METHOD FOR PRODUCING SAME, THERMOSETTING RESIN COMPOSITION CONTAINING SAID FINE PARTICLES, AND SEALING MATERIAL

One of the purposes of the present invention is to provide silicone fine particles which do not aggregate in a thermosetting resin, while having softness derived from silicone rubber and having excellent adhesion with the thermosetting resin. The other purpose is to provide a method for preparing th...

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Bibliographische Detailangaben
Hauptverfasser:	INOKUCHI, Yoshinori, SAKAI, Mio
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FILLING PASTES GENERAL PROCESSES OF COMPOUNDING INKS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS THEREFOR WOODSTAINS WORKING-UP
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Beschreibung
Zusammenfassung:	One of the purposes of the present invention is to provide silicone fine particles which do not aggregate in a thermosetting resin, while having softness derived from silicone rubber and having excellent adhesion with the thermosetting resin. The other purpose is to provide a method for preparing the same. The other purpose is to provide a thermosetting resin composition and an encapsulating material, each comprising the fine particles. The present invention provides an epoxy-modified silicone fine particle composed of (A) a spherical silicone rubber fine particle coated with (B) polyorganosilsesquioxane, wherein the spherical silicone rubber fine particle (A) has an average particle diameter of 0.1 to 100 µm and the polyorganosilsesquioxane (B) has an epoxy group-containing organic group.