SINGLE STEP ELECTROLYTIC METHOD OF FILLING THROUGH HOLES IN PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES

A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one o...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GUGLIOTTI, Carmichael, DECESARE, William J, BELLEMARE, Richard, BLAKE, Ron, DESALVO, Donald
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	GUGLIOTTI, Carmichael DECESARE, William J BELLEMARE, Richard BLAKE, Ron DESALVO, Donald
description	A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4056001A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4056001A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4056001A43</originalsourceid><addsrcrecordid>eNqNy7EKwjAQgOEuDqK-w72AULG6p8m1OYhJubsOTqVIdBEt1PfHDj6A0798_7p4CMU2IIhiBxjQKqdwVbJwQfXJQWqgoRAWBeo59a0HnwIKUISOKSo6sMS2J4U6GXYCJi6bemSQvhZloyjbYnUfn3Pe_bopoEG1fp-n95DnabzlV_4M2FXl6VyWB1Md_yBflMc1BA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SINGLE STEP ELECTROLYTIC METHOD OF FILLING THROUGH HOLES IN PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES</title><source>esp@cenet</source><creator>GUGLIOTTI, Carmichael ; DECESARE, William J ; BELLEMARE, Richard ; BLAKE, Ron ; DESALVO, Donald</creator><creatorcontrib>GUGLIOTTI, Carmichael ; DECESARE, William J ; BELLEMARE, Richard ; BLAKE, Ron ; DESALVO, Donald</creatorcontrib><description>A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.</description><language>eng ; fre ; ger</language><subject>APPARATUS THEREFOR ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=EP&NR=4056001A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240117&DB=EPODOC&CC=EP&NR=4056001A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GUGLIOTTI, Carmichael</creatorcontrib><creatorcontrib>DECESARE, William J</creatorcontrib><creatorcontrib>BELLEMARE, Richard</creatorcontrib><creatorcontrib>BLAKE, Ron</creatorcontrib><creatorcontrib>DESALVO, Donald</creatorcontrib><title>SINGLE STEP ELECTROLYTIC METHOD OF FILLING THROUGH HOLES IN PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES</title><description>A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.</description><subject>APPARATUS THEREFOR</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNy7EKwjAQgOEuDqK-w72AULG6p8m1OYhJubsOTqVIdBEt1PfHDj6A0798_7p4CMU2IIhiBxjQKqdwVbJwQfXJQWqgoRAWBeo59a0HnwIKUISOKSo6sMS2J4U6GXYCJi6bemSQvhZloyjbYnUfn3Pe_bopoEG1fp-n95DnabzlV_4M2FXl6VyWB1Md_yBflMc1BA</recordid><startdate>20240117</startdate><enddate>20240117</enddate><creator>GUGLIOTTI, Carmichael</creator><creator>DECESARE, William J</creator><creator>BELLEMARE, Richard</creator><creator>BLAKE, Ron</creator><creator>DESALVO, Donald</creator><scope>EVB</scope></search><sort><creationdate>20240117</creationdate><title>SINGLE STEP ELECTROLYTIC METHOD OF FILLING THROUGH HOLES IN PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES</title><author>GUGLIOTTI, Carmichael ; DECESARE, William J ; BELLEMARE, Richard ; BLAKE, Ron ; DESALVO, Donald</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4056001A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>APPARATUS THEREFOR</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>GUGLIOTTI, Carmichael</creatorcontrib><creatorcontrib>DECESARE, William J</creatorcontrib><creatorcontrib>BELLEMARE, Richard</creatorcontrib><creatorcontrib>BLAKE, Ron</creatorcontrib><creatorcontrib>DESALVO, Donald</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GUGLIOTTI, Carmichael</au><au>DECESARE, William J</au><au>BELLEMARE, Richard</au><au>BLAKE, Ron</au><au>DESALVO, Donald</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SINGLE STEP ELECTROLYTIC METHOD OF FILLING THROUGH HOLES IN PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES</title><date>2024-01-17</date><risdate>2024</risdate><abstract>A method of copper electroplating in the manufacture of printed circuit boards. The method is used for filling through-holes and micro-vias with copper. The method includes the steps of: (1) preparing an electronic substrate to receive copper electroplating thereon; (2) forming at least one of one or more through-holes and/or one or more micro-vias in the electronic substrate; and (3) electroplating copper in the at one or more through-holes and/or one or more micro-vias by contacting the electronic substrate with an acid copper electroplating solution. The acid copper plating solution comprises a source of copper ions; sulfuric acid; a source of chloride ions; a brightener; a wetter; and a leveler. The acid copper electroplating solution plates the one or more through-holes and/or the one or more micro-vias until metallization is complete.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP4056001A4
source	esp@cenet
subjects	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
title	SINGLE STEP ELECTROLYTIC METHOD OF FILLING THROUGH HOLES IN PRINTED CIRCUIT BOARDS AND OTHER SUBSTRATES
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T12%3A20%3A37IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GUGLIOTTI,%20Carmichael&rft.date=2024-01-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4056001A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true