GLASS COMPOUND ARRANGEMENT

An enclosure is shown, comprising at least a base substrate and a cover substrate, which constitute at least a part of the enclosure, and a function zone situated such that it is circumferentially enclosed in the enclosure. At least the cover substrate comprises preferably a glass or glass-like mate...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MÄÄTTÄNEN, Antti, THOMAS, Jens Ulrich
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	MÄÄTTÄNEN, Antti THOMAS, Jens Ulrich
description	An enclosure is shown, comprising at least a base substrate and a cover substrate, which constitute at least a part of the enclosure, and a function zone situated such that it is circumferentially enclosed in the enclosure. At least the cover substrate comprises preferably a glass or glass-like material. The base substrate and the cover substrate are hermetically welded by means of at least one laser weld line, where the laser weld line comprises a height HL in a direction perpendicular to its connecting plane, and wherein the mechanical stress in the at least one laser weld line is reduced, thus improving the mechanical stability of the enclosure.
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4048643A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4048643A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4048643A13</originalsourceid><addsrcrecordid>eNrjZJBy93EMDlZw9vcN8A_1c1FwDApy9HN39XX1C-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASYGJhZmJsaOhsZEKAEA_a0f9g</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>GLASS COMPOUND ARRANGEMENT</title><source>esp@cenet</source><creator>MÄÄTTÄNEN, Antti ; THOMAS, Jens Ulrich</creator><creatorcontrib>MÄÄTTÄNEN, Antti ; THOMAS, Jens Ulrich</creatorcontrib><description>An enclosure is shown, comprising at least a base substrate and a cover substrate, which constitute at least a part of the enclosure, and a function zone situated such that it is circumferentially enclosed in the enclosure. At least the cover substrate comprises preferably a glass or glass-like material. The base substrate and the cover substrate are hermetically welded by means of at least one laser weld line, where the laser weld line comprises a height HL in a direction perpendicular to its connecting plane, and wherein the mechanical stress in the at least one laser weld line is reduced, thus improving the mechanical stability of the enclosure.</description><language>eng ; fre ; ger</language><subject>CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; GLASS ; MACHINE TOOLS ; MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220831&DB=EPODOC&CC=EP&NR=4048643A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220831&DB=EPODOC&CC=EP&NR=4048643A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MÄÄTTÄNEN, Antti</creatorcontrib><creatorcontrib>THOMAS, Jens Ulrich</creatorcontrib><title>GLASS COMPOUND ARRANGEMENT</title><description>An enclosure is shown, comprising at least a base substrate and a cover substrate, which constitute at least a part of the enclosure, and a function zone situated such that it is circumferentially enclosed in the enclosure. At least the cover substrate comprises preferably a glass or glass-like material. The base substrate and the cover substrate are hermetically welded by means of at least one laser weld line, where the laser weld line comprises a height HL in a direction perpendicular to its connecting plane, and wherein the mechanical stress in the at least one laser weld line is reduced, thus improving the mechanical stability of the enclosure.</description><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>GLASS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJBy93EMDlZw9vcN8A_1c1FwDApy9HN39XX1C-FhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASYGJhZmJsaOhsZEKAEA_a0f9g</recordid><startdate>20220831</startdate><enddate>20220831</enddate><creator>MÄÄTTÄNEN, Antti</creator><creator>THOMAS, Jens Ulrich</creator><scope>EVB</scope></search><sort><creationdate>20220831</creationdate><title>GLASS COMPOUND ARRANGEMENT</title><author>MÄÄTTÄNEN, Antti ; THOMAS, Jens Ulrich</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4048643A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>GLASS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>MÄÄTTÄNEN, Antti</creatorcontrib><creatorcontrib>THOMAS, Jens Ulrich</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MÄÄTTÄNEN, Antti</au><au>THOMAS, Jens Ulrich</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GLASS COMPOUND ARRANGEMENT</title><date>2022-08-31</date><risdate>2022</risdate><abstract>An enclosure is shown, comprising at least a base substrate and a cover substrate, which constitute at least a part of the enclosure, and a function zone situated such that it is circumferentially enclosed in the enclosure. At least the cover substrate comprises preferably a glass or glass-like material. The base substrate and the cover substrate are hermetically welded by means of at least one laser weld line, where the laser weld line comprises a height HL in a direction perpendicular to its connecting plane, and wherein the mechanical stress in the at least one laser weld line is reduced, thus improving the mechanical stability of the enclosure.</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP4048643A1
source	esp@cenet
subjects	CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING GLASS MACHINE TOOLS MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
title	GLASS COMPOUND ARRANGEMENT
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-19T16%3A34%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=M%C3%84%C3%84TT%C3%84NEN,%20Antti&rft.date=2022-08-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4048643A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true