METHOD FOR NON-DESTRUCTIVE INSPECTION OF A STRUCTURE AND CORRESPONDING SYSTEM

The present invention relates to a method for non-destructive inspection of a structure, preferably a through-glass via, TGV, of a substrate, preferably a glass substrate,comprising the steps of- Applying a mouldable mass onto a surface of said structure of said substrate,- Hardening of said mouldab...

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Bibliographische Detailangaben
Hauptverfasser:	Korb, Thomas, Loho, Christoph, Corvers, Stephan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING MEASURING ANGLES MEASURING AREAS MEASURING IRREGULARITIES OF SURFACES OR CONTOURS MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS PHYSICS SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	The present invention relates to a method for non-destructive inspection of a structure, preferably a through-glass via, TGV, of a substrate, preferably a glass substrate,comprising the steps of- Applying a mouldable mass onto a surface of said structure of said substrate,- Hardening of said mouldable mass such that the mass is elastic,- Non-destructive removing of said elastic mass from said structure, and- Analyzing said removed elastic mass according to at least one parameter, preferably a quality parameter.