ADHESIVE FILM, ANTI-PID ENCAPSULATION ADHESIVE FILM, COMPOSITION FORMING ADHESIVE FILM, AND PHOTOVOLTAIC MODULE AND LAMINATED GLASS

Disclosed are an adhesive film, an anti-PID encapsulation adhesive film, a composition forming the adhesive film, and a photovoltaic module and laminated glass. The composition includes: an ethylene copolymer matrix resin, an amide organic compound, a metal oxide and/or a metal hydroxide, herein the...

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Bibliographische Detailangaben
Hauptverfasser:	LIU, Ting, DU, Ganhong, WEI, Mengjuan, HOU, Hongbing, WANG, Fucheng, ZHOU, Guangda, WANG, Haonan, SANG, Yan
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES SEMICONDUCTOR DEVICES USE OF MATERIALS AS ADHESIVES
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