PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE AND MANUFACTURING METHOD THEREOF

The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The ph...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU, Li, SUN, Xinxiang, GAN, Hongfeng, LI, Tinghua, HUANG, Zhen, LUAN, Zhongyu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS
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