MOLDED CIRCUIT BOARD AND CAMERA MODULE, AND MANUFACTURING METHOD THEREFOR AND ELECTRONIC DEVICE COMPRISING SAME

Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	LIU, Li, ZHENG, Chengchang, LI, Tinghua, HUANG, Zhen, LUAN, Zhongyu, LU, Bin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PICTORIAL COMMUNICATION, e.g. TELEVISION PRINTED CIRCUITS
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