DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE
The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) com...
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| creator | ÖTZLINGER, Herbert GLEISSNER, Andreas |
| description | The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9). The disclosure further relates to a distribution module (14) and a distribution method (100). |
| format | Patent |
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The disclosure further relates to a distribution module (14) and a distribution method (100).</description><language>eng ; fre ; ger</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230712&DB=EPODOC&CC=EP&NR=4006210B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230712&DB=EPODOC&CC=EP&NR=4006210B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ÖTZLINGER, Herbert</creatorcontrib><creatorcontrib>GLEISSNER, Andreas</creatorcontrib><title>DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE</title><description>The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9). The disclosure further relates to a distribution module (14) and a distribution method (100).</description><subject>APPARATUS THEREFOR</subject><subject>CHEMISTRY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>METALLURGY</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjcEKwjAQRHvxIOo_7A8IqYr3NN1goG3K7ubQUyklnkQr9f8xVT_AwzAw85hZZ8_SsZArgjjfAHcsWIP1BBpa8gaZwVbBlaCbRYAVmsQbMIEIG_mw39BXnaSCA1ltEIRQS70g3qY1DkU60oLbbHUdbnPc_XyTgUUxl32cHn2cp2GM9_jqsT0pdT7kqsiPfyBvs-83tg</recordid><startdate>20230712</startdate><enddate>20230712</enddate><creator>ÖTZLINGER, Herbert</creator><creator>GLEISSNER, Andreas</creator><scope>EVB</scope></search><sort><creationdate>20230712</creationdate><title>DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE</title><author>ÖTZLINGER, Herbert ; GLEISSNER, Andreas</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4006210B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>APPARATUS THEREFOR</topic><topic>CHEMISTRY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>METALLURGY</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><toplevel>online_resources</toplevel><creatorcontrib>ÖTZLINGER, Herbert</creatorcontrib><creatorcontrib>GLEISSNER, Andreas</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ÖTZLINGER, Herbert</au><au>GLEISSNER, Andreas</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE</title><date>2023-07-12</date><risdate>2023</risdate><abstract>The disclosure relates to a distribution system (1) for a process fluid (18) and an electric current for a chemical and/or electrolytic surface treatment of a substrate (9), comprising a distribution body (2), a primary cathode (30), and a secondary cathode (3), wherein the distribution body (2) comprises several openings (4) for the process fluid (18) and the electric current, wherein the several openings (4) are arranged at a front face (10) of the distribution body (2), wherein the front face (10) is directed to the primary cathode (30), wherein the primary cathode (30) and the secondary cathode (3) are arranged to attract the electric current and to guide the electric current to the substrate (9) to be treated, wherein the secondary cathode (3) comprises several cathode pixels (13), wherein the several cathode pixels (13) are distributed in an array to be aligned with at least an area of the substrate (9) to be treated, and wherein the several cathode pixels (13) are individually controllable for adjusting a distribution of the electric current at the substrate (9). The disclosure further relates to a distribution module (14) and a distribution method (100).</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | DISTRIBUTION SYSTEM FOR A PROCESS FLUID AND AN ELECTRIC CURRENT FOR ELECTROLYTIC SURFACE TREATMENT OF A SUBSTRATE |
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