VERTICAL METAL SPLITTING USING HELMETS AND WRAP AROUND DIELECTRIC SPACERS

Methods for fabricating an IC structure, e.g., for fabricating a metallization stack portion of an IC structure, as well as related semiconductor devices, are disclosed. An example fabrication method includes splitting metal lines that are supposed to be included at a tight pitch in a single metalli...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	NYHUS, Paul A, GULER, Leonard P, WALLACE, Charles Henry
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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