CAMERA MODULE, AND PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR

Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: CHEN, Kai, LIU, Li, HUANG, Zhen, LUAN, Zhongyu
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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