CAMERA MODULE, AND PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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