SYSTEM AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE
The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharg...
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| creator | KIM, Sanghwa KIM, Sungmoon ROH, Hyungrae KIM, Jinwoo RYU, Euidock |
| description | The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharges the second substrate therefrom; and a transfer device which transfers the first substrate into the hot press device while regulating the amount of supplied first composite substrates. |
| format | Patent |
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and a transfer device which transfers the first substrate into the hot press device while regulating the amount of supplied first composite substrates.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220504&DB=EPODOC&CC=EP&NR=3993577A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220504&DB=EPODOC&CC=EP&NR=3993577A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Sanghwa</creatorcontrib><creatorcontrib>KIM, Sungmoon</creatorcontrib><creatorcontrib>ROH, Hyungrae</creatorcontrib><creatorcontrib>KIM, Jinwoo</creatorcontrib><creatorcontrib>RYU, Euidock</creatorcontrib><title>SYSTEM AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE</title><description>The present invention relates to a system for manufacturing a composite substrate, the system comprising: a hot-press device which hot-presses a first composite substrate comprising a printed circuit board and a coverlay temporarily attached thereto to form a second composite substrate, and discharges the second substrate therefrom; 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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| title | SYSTEM AND METHOD FOR MANUFACTURING COMPOSITE SUBSTRATE |
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