ELECTRONIC COMPONENT ATTACHING DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STRAP
An object of the present invention is to provide an electronic component mounting device which enables efficient, highly accurate mounting of electronic components on attachments, and can also be easily configured in response to a change in kind of the attachment. The present invention is an electro...
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| creator | HAYASHIDA Toru AOYAMA Hiroshi |
| description | An object of the present invention is to provide an electronic component mounting device which enables efficient, highly accurate mounting of electronic components on attachments, and can also be easily configured in response to a change in kind of the attachment. The present invention is an electronic component mounting device for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion, the electronic component mounting device including: a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion; a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments; and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments. |
| format | Patent |
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The present invention is an electronic component mounting device for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion, the electronic component mounting device including: a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion; a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments; and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220330&DB=EPODOC&CC=EP&NR=3975227A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220330&DB=EPODOC&CC=EP&NR=3975227A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HAYASHIDA Toru</creatorcontrib><creatorcontrib>AOYAMA Hiroshi</creatorcontrib><title>ELECTRONIC COMPONENT ATTACHING DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STRAP</title><description>An object of the present invention is to provide an electronic component mounting device which enables efficient, highly accurate mounting of electronic components on attachments, and can also be easily configured in response to a change in kind of the attachment. The present invention is an electronic component mounting device for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion, the electronic component mounting device including: a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion; a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments; and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZCh19XF1Dgny9_N0VnD29w3w93P1C1FwDAlxdPbw9HNXcHEN83R21VHwdQ3x8HdRcPMPUvB19At1c3QOCQ0CKUDSD1Pr6OeCW31wSJBjAA8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXcNMLY0NzUyMnc0NCZCCQB9EDjN</recordid><startdate>20220330</startdate><enddate>20220330</enddate><creator>HAYASHIDA Toru</creator><creator>AOYAMA Hiroshi</creator><scope>EVB</scope></search><sort><creationdate>20220330</creationdate><title>ELECTRONIC COMPONENT ATTACHING DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STRAP</title><author>HAYASHIDA Toru ; AOYAMA Hiroshi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3975227A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HAYASHIDA Toru</creatorcontrib><creatorcontrib>AOYAMA Hiroshi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HAYASHIDA Toru</au><au>AOYAMA Hiroshi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC COMPONENT ATTACHING DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STRAP</title><date>2022-03-30</date><risdate>2022</risdate><abstract>An object of the present invention is to provide an electronic component mounting device which enables efficient, highly accurate mounting of electronic components on attachments, and can also be easily configured in response to a change in kind of the attachment. The present invention is an electronic component mounting device for mounting, at different intervals from each other on attachments, a plurality of electronic components which have been placed in a predetermined portion, the electronic component mounting device including: a removal mechanism for removing some of the plurality of the electronic components being placed in the predetermined portion; a transport mechanism for transporting the electronic components removed by the removal mechanism, moving the electronic components such that, before reaching the attachments, the plurality of the electronic components are at the different intervals at which they will be mounted on the attachments, and transporting the electronic components to the attachments; and a mounting and transfer mechanism for mounting the electronic components, which have been transported by the transport mechanism, on predetermined positions of the attachments.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES |
| title | ELECTRONIC COMPONENT ATTACHING DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND METHOD FOR MANUFACTURING STRAP |
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