POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufact...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SEO, Jang Won, YUN, Jong Wook, HEO, Hye Young, AHN, Jae In, JOENG, Eun Sun
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TRANSPORTING
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