POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME

The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufact...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: SEO, Jang Won, YUN, Jong Wook, HEO, Hye Young, AHN, Jae In, JOENG, Eun Sun
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator SEO, Jang Won
YUN, Jong Wook
HEO, Hye Young
AHN, Jae In
JOENG, Eun Sun
description The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3974109B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3974109B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3974109B13</originalsourceid><addsrcrecordid>eNqNi70KwjAURrM4iPoO9wEULBWk4zW5MQHzQ366liLRRbRQ3x9bcHB0-uB85yzZ3buLjkrbM3gUWzBos0SecpiRoaScgKQokJOAVoAP5PH3nHgko7mzIvPkAghqNSfIcZamFCIaWrPFrX-MZfPdFQNJiatdGV5dGYf-Wp7l3ZGvm-Oh2jenqv5D-QB26zTX</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</title><source>esp@cenet</source><creator>SEO, Jang Won ; YUN, Jong Wook ; HEO, Hye Young ; AHN, Jae In ; JOENG, Eun Sun</creator><creatorcontrib>SEO, Jang Won ; YUN, Jong Wook ; HEO, Hye Young ; AHN, Jae In ; JOENG, Eun Sun</creatorcontrib><description>The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.</description><language>eng ; fre ; ger</language><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; PERFORMING OPERATIONS ; POLISHING ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240515&amp;DB=EPODOC&amp;CC=EP&amp;NR=3974109B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20240515&amp;DB=EPODOC&amp;CC=EP&amp;NR=3974109B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SEO, Jang Won</creatorcontrib><creatorcontrib>YUN, Jong Wook</creatorcontrib><creatorcontrib>HEO, Hye Young</creatorcontrib><creatorcontrib>AHN, Jae In</creatorcontrib><creatorcontrib>JOENG, Eun Sun</creatorcontrib><title>POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</title><description>The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.</description><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi70KwjAURrM4iPoO9wEULBWk4zW5MQHzQ366liLRRbRQ3x9bcHB0-uB85yzZ3buLjkrbM3gUWzBos0SecpiRoaScgKQokJOAVoAP5PH3nHgko7mzIvPkAghqNSfIcZamFCIaWrPFrX-MZfPdFQNJiatdGV5dGYf-Wp7l3ZGvm-Oh2jenqv5D-QB26zTX</recordid><startdate>20240515</startdate><enddate>20240515</enddate><creator>SEO, Jang Won</creator><creator>YUN, Jong Wook</creator><creator>HEO, Hye Young</creator><creator>AHN, Jae In</creator><creator>JOENG, Eun Sun</creator><scope>EVB</scope></search><sort><creationdate>20240515</creationdate><title>POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</title><author>SEO, Jang Won ; YUN, Jong Wook ; HEO, Hye Young ; AHN, Jae In ; JOENG, Eun Sun</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3974109B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>SEO, Jang Won</creatorcontrib><creatorcontrib>YUN, Jong Wook</creatorcontrib><creatorcontrib>HEO, Hye Young</creatorcontrib><creatorcontrib>AHN, Jae In</creatorcontrib><creatorcontrib>JOENG, Eun Sun</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SEO, Jang Won</au><au>YUN, Jong Wook</au><au>HEO, Hye Young</au><au>AHN, Jae In</au><au>JOENG, Eun Sun</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME</title><date>2024-05-15</date><risdate>2024</risdate><abstract>The present disclosure relates to a polishing pad, a method of manufacturing the polishing pad, and a method of manufacturing a semiconductor device using the same. In the polishing pad, an unexpanded solid-phase blowing agent is included in a polishing composition when a polishing layer is manufactured, and the unexpanded solid-phase blowing agent is expanded during a curing process to form a plurality of uniform pores in the polishing layer, such that defects occurring on a surface of the semiconductor substrate may be prevented. In addition, the present disclosure may provide a method of manufacturing a semiconductor device to which the polishing pad is applied.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3974109B1
source esp@cenet
subjects DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
title POLISHING PAD, MANUFACTURING METHOD THEREOF AND PREPARING METHOD OF SEMICONDUCTOR DEVICE USING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-17T23%3A32%3A20IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=SEO,%20Jang%20Won&rft.date=2024-05-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3974109B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true