INTEGRATED STRUCTURES WITH ANTENNA ELEMENTS AND IC CHIPS EMPLOYING EDGE CONTACT CONNECTIONS

INTEGRATED STRUCTURES WITH ANTENNA ELEMENTS AND IC CHIPS EMPLOYING EDGE CONTACT CONNECTIONS

An electronic device is provided. The electronic device comprises: a substrate, an integrated circuit chip and a component. The substrate has a cavity in an outer surface thereof. The substrate has a sidewall defining a portion of the cavity. A first edge contact is formed at the sidewall. The integ...

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Hauptverfasser: FRANSON, Steven J, MATHEWS, Douglas J
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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MATHEWS, Douglas J
description An electronic device is provided. The electronic device comprises: a substrate, an integrated circuit chip and a component. The substrate has a cavity in an outer surface thereof. The substrate has a sidewall defining a portion of the cavity. A first edge contact is formed at the sidewall. The integrated circuit chip is disposed within the cavity, having a bottom surface facing a bottom surface of the cavity, a side surface facing the sidewall, and a second edge contact formed on the side surface electrically connected to the first edge contact. The integrated circuit chip includes one or more electronic circuits connected to a connection element at the bottom surface of the integrated circuit chip. The component is supported by the substrate and coupled to the one or more electronic circuits through the connection element.
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subjects ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title INTEGRATED STRUCTURES WITH ANTENNA ELEMENTS AND IC CHIPS EMPLOYING EDGE CONTACT CONNECTIONS
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