CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME
A ceramic copper circuit board (1) including a ceramic substrate (2), and a copper circuit part (3) located on the ceramic substrate (2), wherein an arbitrary line parallel to a first direction at a cross section of the copper circuit part (3) parallel to the first direction crosses multiple copper...
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| creator | NABA, Takayuki KATO, Hiromasa YANO, Keiichi |
| description | A ceramic copper circuit board (1) including a ceramic substrate (2), and a copper circuit part (3) located on the ceramic substrate (2), wherein an arbitrary line parallel to a first direction at a cross section of the copper circuit part (3) parallel to the first direction crosses multiple copper crystal grains (10), the first direction is from the ceramic substrate (2) toward the copper circuit part (3), an average of multiple distances in a second direction between the line and edges of the copper crystal grains (10) is not more than 300 µm, and the second direction is perpendicular to the first direction. |
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fre ; ger</language><subject>ALLOYS ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220216&DB=EPODOC&CC=EP&NR=3954795A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20220216&DB=EPODOC&CC=EP&NR=3954795A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NABA, Takayuki</creatorcontrib><creatorcontrib>KATO, Hiromasa</creatorcontrib><creatorcontrib>YANO, Keiichi</creatorcontrib><title>CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME</title><description>A ceramic copper circuit board (1) including a ceramic substrate (2), and a copper circuit part (3) located on the ceramic substrate (2), wherein an arbitrary line parallel to a first direction at a cross section of the copper circuit part (3) parallel to the first direction crosses multiple copper crystal grains (10), the first direction is from the ceramic substrate (2) toward the copper circuit part (3), an average of multiple distances in a second direction between the line and edges of the copper crystal grains (10) is not more than 300 µm, and the second direction is perpendicular to the first direction.</description><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBwdg1y9PV0VnD2DwhwDVJw9gxyDvUMUXDydwxyUXD0c1EIdgVK-_u5hDqH-AcpuLiGeTq7KoQGe_q5KwQ7-rryMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wBjS1MTc0tTR0NjIpQAAEIoKik</recordid><startdate>20220216</startdate><enddate>20220216</enddate><creator>NABA, Takayuki</creator><creator>KATO, Hiromasa</creator><creator>YANO, Keiichi</creator><scope>EVB</scope></search><sort><creationdate>20220216</creationdate><title>CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME</title><author>NABA, Takayuki ; 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| language | eng ; fre ; ger |
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| source | esp@cenet |
| subjects | ALLOYS BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | CERAMIC COPPER CIRCUIT BOARD AND SEMICONDUCTOR DEVICE USING SAME |
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