PATTERNING OF MULTI-DEPTH OPTICAL DEVICES

PATTERNING OF MULTI-DEPTH OPTICAL DEVICES

Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portio...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MCMACKIN, Ian Matthew, MCMILLAN, Wayne, CHEN, Chien-An, GODET, Ludovic, COHEN, Brian Alexander
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MCMACKIN, Ian Matthew
MCMILLAN, Wayne
CHEN, Chien-An
GODET, Ludovic
COHEN, Brian Alexander
description Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3953746A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3953746A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3953746A13</originalsourceid><addsrcrecordid>eNrjZNAMcAwJcQ3y8_RzV_B3U_AN9Qnx1HVxDQjxUPAPCPF0dvRRcHEN83R2DeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcaWpsbmJmaOhsZEKAEA7HIkDw</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PATTERNING OF MULTI-DEPTH OPTICAL DEVICES</title><source>esp@cenet</source><creator>MCMACKIN, Ian Matthew ; MCMILLAN, Wayne ; CHEN, Chien-An ; GODET, Ludovic ; COHEN, Brian Alexander</creator><creatorcontrib>MCMACKIN, Ian Matthew ; MCMILLAN, Wayne ; CHEN, Chien-An ; GODET, Ludovic ; COHEN, Brian Alexander</creatorcontrib><description>Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.</description><language>eng ; fre ; ger</language><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; PHYSICS</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220216&amp;DB=EPODOC&amp;CC=EP&amp;NR=3953746A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220216&amp;DB=EPODOC&amp;CC=EP&amp;NR=3953746A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MCMACKIN, Ian Matthew</creatorcontrib><creatorcontrib>MCMILLAN, Wayne</creatorcontrib><creatorcontrib>CHEN, Chien-An</creatorcontrib><creatorcontrib>GODET, Ludovic</creatorcontrib><creatorcontrib>COHEN, Brian Alexander</creatorcontrib><title>PATTERNING OF MULTI-DEPTH OPTICAL DEVICES</title><description>Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.</description><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAMcAwJcQ3y8_RzV_B3U_AN9Qnx1HVxDQjxUPAPCPF0dvRRcHEN83R2DeZhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuAcaWpsbmJmaOhsZEKAEA7HIkDw</recordid><startdate>20220216</startdate><enddate>20220216</enddate><creator>MCMACKIN, Ian Matthew</creator><creator>MCMILLAN, Wayne</creator><creator>CHEN, Chien-An</creator><creator>GODET, Ludovic</creator><creator>COHEN, Brian Alexander</creator><scope>EVB</scope></search><sort><creationdate>20220216</creationdate><title>PATTERNING OF MULTI-DEPTH OPTICAL DEVICES</title><author>MCMACKIN, Ian Matthew ; MCMILLAN, Wayne ; CHEN, Chien-An ; GODET, Ludovic ; COHEN, Brian Alexander</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3953746A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>MCMACKIN, Ian Matthew</creatorcontrib><creatorcontrib>MCMILLAN, Wayne</creatorcontrib><creatorcontrib>CHEN, Chien-An</creatorcontrib><creatorcontrib>GODET, Ludovic</creatorcontrib><creatorcontrib>COHEN, Brian Alexander</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MCMACKIN, Ian Matthew</au><au>MCMILLAN, Wayne</au><au>CHEN, Chien-An</au><au>GODET, Ludovic</au><au>COHEN, Brian Alexander</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PATTERNING OF MULTI-DEPTH OPTICAL DEVICES</title><date>2022-02-16</date><risdate>2022</risdate><abstract>Methods for patterning of multi-depth layers for the fabrication of optical devices are provided. In one embodiment, a method is provided that includes disposing a resist layer over a device layer disposed over a top surface of a substrate, the device layer having a first portion and a second portion, patterning the resist layer to form a first resist layer pattern having a plurality of first openings and a second resist layer pattern having a plurality of second openings, and etching exposed portions of the device layer defined by the plurality of first openings and the plurality of second openings, wherein the plurality of first openings are configured to form at least a portion of a plurality of first structures within the optical device, and the plurality of second openings are configured to form at least a portion of a plurality of second structures within the optical device.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3953746A1
source esp@cenet
subjects OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
title PATTERNING OF MULTI-DEPTH OPTICAL DEVICES
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-14T14%3A12%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MCMACKIN,%20Ian%20Matthew&rft.date=2022-02-16&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3953746A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true