MULTICOMPONENT TYPE CURABLE ORGANOPOLYSILOXANE COMPOSITION, THERMALLY CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE

[Problem] To provide a curable organopolysiloxane composition having: high thermal conductivity, excellent deep curability under room temperature, excellent adhesion to various base materials, and excellent tight fitting properties to heat dissipating components and the like; a thermally conductive...

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Bibliographische Detailangaben
Hauptverfasser: OTA, Kenji, KODAMA, Harumi, FUJISAWA, Toyohiko
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:[Problem] To provide a curable organopolysiloxane composition having: high thermal conductivity, excellent deep curability under room temperature, excellent adhesion to various base materials, and excellent tight fitting properties to heat dissipating components and the like; a thermally conductive member containing the same; and a heat dissipating structure using the same.[Resolution Means] A multicomponent curable organopolysiloxane composition containing: a diorganopolysiloxane with a molecular terminal blocked by a hydroxysilyl group; (B) a diorganopolysiloxane with a molecular terminal blocked by an alkoxysilyl group; (C) a thermally conductive filler; (D) an organic silicon compound serving as a surface treating agent of component (C); (E) a component selected from alkylalkoxysilanes and specific adhesionimparting agents; and (F) a catalytic amount of a condensation-reaction catalyst; where at least the following liquid (I) and liquid (II), which are stored separately, are included; as well as a use thereof.