THERMAL INTERFACE MATERIAL AND METHOD FOR TRANSFERRING HEAT
A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in th...
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creator | BLISS, Michael John CHEN, Huijuan |
description | A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler including: particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material; and diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3945564B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3945564B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3945564B13</originalsourceid><addsrcrecordid>eNrjZLAO8XAN8nX0UfD0C3ENcnN0dlXwdQSyPIFCjn4uCr6uIR7-Lgpu_kEKIUGOfsFurkFBnn7uCh6ujiE8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDY0sTU1MzEydCYCCUAfwgo0w</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMAL INTERFACE MATERIAL AND METHOD FOR TRANSFERRING HEAT</title><source>esp@cenet</source><creator>BLISS, Michael John ; CHEN, Huijuan</creator><creatorcontrib>BLISS, Michael John ; CHEN, Huijuan</creatorcontrib><description>A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler including: particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material; and diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material.</description><language>eng ; fre ; ger</language><subject>ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240807&DB=EPODOC&CC=EP&NR=3945564B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240807&DB=EPODOC&CC=EP&NR=3945564B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BLISS, Michael John</creatorcontrib><creatorcontrib>CHEN, Huijuan</creatorcontrib><title>THERMAL INTERFACE MATERIAL AND METHOD FOR TRANSFERRING HEAT</title><description>A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler including: particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material; and diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material.</description><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAO8XAN8nX0UfD0C3ENcnN0dlXwdQSyPIFCjn4uCr6uIR7-Lgpu_kEKIUGOfsFurkFBnn7uCh6ujiE8DKxpiTnFqbxQmptBwc01xNlDN7UgPz61uCAxOTUvtSTeNcDY0sTU1MzEydCYCCUAfwgo0w</recordid><startdate>20240807</startdate><enddate>20240807</enddate><creator>BLISS, Michael John</creator><creator>CHEN, Huijuan</creator><scope>EVB</scope></search><sort><creationdate>20240807</creationdate><title>THERMAL INTERFACE MATERIAL AND METHOD FOR TRANSFERRING HEAT</title><author>BLISS, Michael John ; CHEN, Huijuan</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3945564B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>BLISS, Michael John</creatorcontrib><creatorcontrib>CHEN, Huijuan</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BLISS, Michael John</au><au>CHEN, Huijuan</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL INTERFACE MATERIAL AND METHOD FOR TRANSFERRING HEAT</title><date>2024-08-07</date><risdate>2024</risdate><abstract>A thermal interface material for forming a layer conformable between a first heat transfer surface and an opposing second heat transfer surface to provide a thermal pathway therebetween includes: a matrix material composing 10 wt. % or less of the thermal interface material; a filler dispersed in the matrix material composing at least 80 wt. % of the thermal interface material, the filler including: particles of a first material having a nominal dimension in a range from 1 micron to 100 microns, the first material composing at least 40 wt. % of the thermal interface material; and diamond particles having a nominal dimension of 1,000 nm or less, the diamond particles composing 0.5 wt. % to 5 wt. % of the thermal interface material.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
title | THERMAL INTERFACE MATERIAL AND METHOD FOR TRANSFERRING HEAT |
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