AVALANCHE-PHOTODIODE SENSOR AND DISTANCE MEASUREMENT DEVICE

Distance measurement accuracy is improved. An avalanche photodiode sensor according to an embodiment includes a first semiconductor substrate (51) and a second semiconductor substrate (52) bonded to a first surface of the first semiconductor substrate, wherein the first semiconductor substrate inclu...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	WAKANO, Toshifumi, YAGI, Shinichiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ANALOGOUS ARRANGEMENTS USING OTHER WAVES BASIC ELECTRIC ELEMENTS DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES MEASURING PHYSICS RADIO DIRECTION-FINDING RADIO NAVIGATION SEMICONDUCTOR DEVICES TESTING
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Beschreibung
Zusammenfassung:	Distance measurement accuracy is improved. An avalanche photodiode sensor according to an embodiment includes a first semiconductor substrate (51) and a second semiconductor substrate (52) bonded to a first surface of the first semiconductor substrate, wherein the first semiconductor substrate includes a plurality of photoelectric conversion portions (21) arranged in a matrix and an element separation portion (157) for element-separating the plurality of photoelectric conversion portions from each other, the plurality of photoelectric conversion portions include a first photoelectric conversion portion (21), the element separation portion has a first element separation region (157A) and a second element separation region (157B), the first photoelectric conversion portion is arranged between the first element separation region and the second element separation region, the first semiconductor substrate further includes a plurality of concave-convex portions (181) arranged on a second surface opposite to the first surface and arranged between the first element separation region and the second element separation region, and the second semiconductor substrate includes a reading circuit (22) connected to each of the photoelectric conversion portions.