HEATSINK MEMBER AND ELECTRONIC DEVICE PROVIDED WITH SAME

HEATSINK MEMBER AND ELECTRONIC DEVICE PROVIDED WITH SAME

A heat dissipation member according to the present disclosure includes a first wall part with insulating properties; a second wall part located opposite the first wall part; a third wall part located between the first wall part and the second wall part; a flow path surrounded by the first wall part,...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: MUNEISHI, Takeshi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A heat dissipation member according to the present disclosure includes a first wall part with insulating properties; a second wall part located opposite the first wall part; a third wall part located between the first wall part and the second wall part; a flow path surrounded by the first wall part, the second wall part, and the third wall part; a conductive layer located on an outer surface of the first wall part; and a first metal layer located on an inner surface of the first wall part, the first metal layer including gaps. Furthermore, an electronic device of the present disclosure includes the heat dissipation member with the configuration described above and an electronic component located on the conductive layer of the heat dissipation member.