POLYIMIDE COMPOUND AND MOLDED ARTICLE CONTAINING SAID POLYIMIDE COMPOUND
Provided a polyimide compound having high heat resistance and transparency. The polyimide compound according to the present invention is characterized in that it is a reaction product of a diamine compound represented by the following general formula (1):and an alicyclic tetracarboxylic acid dianhyd...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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