METHOD OF MAKING A THREE DIMENSIONAL HORIZONTAL COIL STRUCTURE WITHIN A MOLD COMPOUND PACKAGE HAVING AT LEAST ONE INTEGRATED CIRCUIT CHIP

METHOD OF MAKING A THREE DIMENSIONAL HORIZONTAL COIL STRUCTURE WITHIN A MOLD COMPOUND PACKAGE HAVING AT LEAST ONE INTEGRATED CIRCUIT CHIP

An apparatus including a package substrate (210) including at least one three-dimensional printed passive structure (245) and one or more integrated circuit chips (230) embedded in a molding material.

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Bibliographische Detailangaben
Hauptverfasser: Albers, Sven, Wolter, Andreas, Reingruber, Klaus, Meyer, Thorsten
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An apparatus including a package substrate (210) including at least one three-dimensional printed passive structure (245) and one or more integrated circuit chips (230) embedded in a molding material.