ADDITIVE MANUFACTURED HEAT SINK

A heat sink includes a baseplate of thermally-conductive material and a radiator for transferring heat to atmosphere around the radiator. The baseplate is configured to be in thermal communication with a heat source, such as an integrated circuit or a power electronic device. The radiator is dispose...

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Bibliographische Detailangaben
Hauptverfasser: ABATE, Vito, DEAVILLE, Todd, DURFEE, Jason
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:A heat sink includes a baseplate of thermally-conductive material and a radiator for transferring heat to atmosphere around the radiator. The baseplate is configured to be in thermal communication with a heat source, such as an integrated circuit or a power electronic device. The radiator is disposed upon the baseplate and includes a skin of melted material formed by additive manufacturing which encloses a chamber. An outer wick of porous material is disposed within the chamber, the outer wick coats an inner surface of the skin. A refrigerant is disposed within the chamber. The refrigerant changes between a liquid phase and a vapor phase to convey heat from the baseplate to the skin, and is conveyed back through the wick in the liquid phase by capillary action. The radiator also includes a plurality of fins extending from a cover to promote heat transfer to the atmosphere.