CHIP MOLDING STRUCTURE, WAFER LEVEL CHIP SCALE PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF

A chip molding structure, a wafer level chip scale packaging structure and manufacturing methods thereof are disclosed, relating to the technical field of semiconductor production. The method of making a wafer level chip scale packaging structure includes: providing a wafer, comprising a plurality o...

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Bibliographische Detailangaben

Hauptverfasser:	CHUANG, Ling-Yi, LIN, Dingyou
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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