ADHESIVE RESIN COMPOSITIONS AND LAMINATES USING SAME

Provided is adhesive resin compositions comprising (A) 30 to 70% by mass of an acid-modified polypropylene-based resin; (B) 20 to 60% by mass of a polypropylene-based resin; and (C) 2 to 20% by mass of a copolymer of ethylene and one or more kinds of comonomers selected from the group consisting of...

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Bibliographische Detailangaben
1. Verfasser:	ZENNYOJI, Yoshihiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES
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