ADHESIVE RESIN COMPOSITIONS AND LAMINATES USING SAME

Provided is adhesive resin compositions comprising (A) 30 to 70% by mass of an acid-modified polypropylene-based resin; (B) 20 to 60% by mass of a polypropylene-based resin; and (C) 2 to 20% by mass of a copolymer of ethylene and one or more kinds of comonomers selected from the group consisting of...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
1. Verfasser:	ZENNYOJI, Yoshihiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CHEMISTRY CONDUCTORS DYES ELECTRICITY INSULATORS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	Provided is adhesive resin compositions comprising (A) 30 to 70% by mass of an acid-modified polypropylene-based resin; (B) 20 to 60% by mass of a polypropylene-based resin; and (C) 2 to 20% by mass of a copolymer of ethylene and one or more kinds of comonomers selected from the group consisting of vinyl acetate, alkyl methacrylate, and alkyl acrylate, with the proviso that the sum of the percentages of the above component (A), the above component (B), and the above component (C) is 100% by mass.