METHOD FOR MANUFACTURING A CARD MODULE AND MODULE OBTAINED

A method for manufacturing an electronic module comprising, in combination, at least the following steps * using a substrate (1) comprising, on at least one face (1a), one or more electrically conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c), * connecting a...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	GERIN, Guillaume, MEAR, Benjamin
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

container_end_page
container_issue
container_start_page
container_title
container_volume
creator	GERIN, Guillaume MEAR, Benjamin
description	A method for manufacturing an electronic module comprising, in combination, at least the following steps * using a substrate (1) comprising, on at least one face (1a), one or more electrically conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c), * connecting an integrated circuit (3) to at least one contact pad (2c) * providing one or more electrically conductive elements (6), * connecting the electrically conductive element or elements (6) to the conductive pads (2b) of the substrate (1) by using an electrically conductive adhesive (7).
format	Patent
fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3853775A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3853775A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3853775A13</originalsourceid><addsrcrecordid>eNrjZLDydQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcFRwdgxyUfD1dwn1cVVw9IMz_Z1CHD39XF14GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4Cxhamxubmpo6ExEUoAPSsoUQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR MANUFACTURING A CARD MODULE AND MODULE OBTAINED</title><source>esp@cenet</source><creator>GERIN, Guillaume ; MEAR, Benjamin</creator><creatorcontrib>GERIN, Guillaume ; MEAR, Benjamin</creatorcontrib><description>A method for manufacturing an electronic module comprising, in combination, at least the following steps * using a substrate (1) comprising, on at least one face (1a), one or more electrically conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c), * connecting an integrated circuit (3) to at least one contact pad (2c) * providing one or more electrically conductive elements (6), * connecting the electrically conductive element or elements (6) to the conductive pads (2b) of the substrate (1) by using an electrically conductive adhesive (7).</description><language>eng ; fre ; ger</language><subject>CALCULATING ; COMPUTING ; COUNTING ; HANDLING RECORD CARRIERS ; PHYSICS ; PRESENTATION OF DATA ; RECOGNITION OF DATA ; RECORD CARRIERS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210728&DB=EPODOC&CC=EP&NR=3853775A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210728&DB=EPODOC&CC=EP&NR=3853775A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>GERIN, Guillaume</creatorcontrib><creatorcontrib>MEAR, Benjamin</creatorcontrib><title>METHOD FOR MANUFACTURING A CARD MODULE AND MODULE OBTAINED</title><description>A method for manufacturing an electronic module comprising, in combination, at least the following steps * using a substrate (1) comprising, on at least one face (1a), one or more electrically conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c), * connecting an integrated circuit (3) to at least one contact pad (2c) * providing one or more electrically conductive elements (6), * connecting the electrically conductive element or elements (6) to the conductive pads (2b) of the substrate (1) by using an electrically conductive adhesive (7).</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>HANDLING RECORD CARRIERS</subject><subject>PHYSICS</subject><subject>PRESENTATION OF DATA</subject><subject>RECOGNITION OF DATA</subject><subject>RECORD CARRIERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDydQ3x8HdRcPMPUvB19At1c3QOCQ3y9HNXcFRwdgxyUfD1dwn1cVVw9IMz_Z1CHD39XF14GFjTEnOKU3mhNDeDgptriLOHbmpBfnxqcUFicmpeakm8a4Cxhamxubmpo6ExEUoAPSsoUQ</recordid><startdate>20210728</startdate><enddate>20210728</enddate><creator>GERIN, Guillaume</creator><creator>MEAR, Benjamin</creator><scope>EVB</scope></search><sort><creationdate>20210728</creationdate><title>METHOD FOR MANUFACTURING A CARD MODULE AND MODULE OBTAINED</title><author>GERIN, Guillaume ; MEAR, Benjamin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3853775A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>HANDLING RECORD CARRIERS</topic><topic>PHYSICS</topic><topic>PRESENTATION OF DATA</topic><topic>RECOGNITION OF DATA</topic><topic>RECORD CARRIERS</topic><toplevel>online_resources</toplevel><creatorcontrib>GERIN, Guillaume</creatorcontrib><creatorcontrib>MEAR, Benjamin</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>GERIN, Guillaume</au><au>MEAR, Benjamin</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR MANUFACTURING A CARD MODULE AND MODULE OBTAINED</title><date>2021-07-28</date><risdate>2021</risdate><abstract>A method for manufacturing an electronic module comprising, in combination, at least the following steps * using a substrate (1) comprising, on at least one face (1a), one or more electrically conductive tracks (2), at least one conductive strip (2b) and at least one contact pad (2c), * connecting an integrated circuit (3) to at least one contact pad (2c) * providing one or more electrically conductive elements (6), * connecting the electrically conductive element or elements (6) to the conductive pads (2b) of the substrate (1) by using an electrically conductive adhesive (7).</abstract><oa>free_for_read</oa></addata></record>
fulltext	fulltext_linktorsrc
identifier
ispartof
issn
language	eng ; fre ; ger
recordid	cdi_epo_espacenet_EP3853775A1
source	esp@cenet
subjects	CALCULATING COMPUTING COUNTING HANDLING RECORD CARRIERS PHYSICS PRESENTATION OF DATA RECOGNITION OF DATA RECORD CARRIERS
title	METHOD FOR MANUFACTURING A CARD MODULE AND MODULE OBTAINED
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T20%3A55%3A26IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=GERIN,%20Guillaume&rft.date=2021-07-28&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3853775A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true