MODULE BASE WITH INTEGRATED THERMAL SPREADER AND HEAT SINK FOR THERMAL AND STRUCTURAL MANAGEMENT OF HIGH-PERFORMANCE INTEGRATED CIRCUITS OR OTHER DEVICES

An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BROOKS, David A, HERNDON, Mary K, GUPTA, Anurag
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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