INTEGRATED CIRCUIT PACKAGE COMPRISING AN ENHANCED ELECTROMAGNETIC SHIELD

INTEGRATED CIRCUIT PACKAGE COMPRISING AN ENHANCED ELECTROMAGNETIC SHIELD

Some features pertain to a package that includes an enhanced electromagnetic shield. The package includes a substrate, an electronic component coupled to the substrate, and a mold partially surrounding the electronic component. The package further includes a first shield over the mold, and a second...

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Hauptverfasser: REITLINGER, Claus, KREFFT, Anna Katharina
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator REITLINGER, Claus
KREFFT, Anna Katharina
description Some features pertain to a package that includes an enhanced electromagnetic shield. The package includes a substrate, an electronic component coupled to the substrate, and a mold partially surrounding the electronic component. The package further includes a first shield over the mold, and a second shield over the first shield. One of the first shield or the second shield is a high permeability shield and the remaining first or second shield is a high conductivity shield relative to the high permeability shield.
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title INTEGRATED CIRCUIT PACKAGE COMPRISING AN ENHANCED ELECTROMAGNETIC SHIELD
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