PCB STRUCTURES IN SMT
A technique for creating a printed circuit board (PCB) with 3D structure entails Manufacturing a main PCB and a plurality of PCB pieces. The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel pl...
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creator | MOLDSVOR, Oystein |
description | A technique for creating a printed circuit board (PCB) with 3D structure entails Manufacturing a main PCB and a plurality of PCB pieces. The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. The tape and reel placement machine may also contain a tape loaded with other SMTs, which may be affixed to the main PC. |
format | Patent |
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The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. 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The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. The tape and reel placement machine may also contain a tape loaded with other SMTs, which may be affixed to the main PC.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBANcHZSCA4JCnUOCQ1yDVbw9FMI9g3hYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgHGFsbmlkYWjobGRCgBAGClHpg</recordid><startdate>20210623</startdate><enddate>20210623</enddate><creator>MOLDSVOR, Oystein</creator><scope>EVB</scope></search><sort><creationdate>20210623</creationdate><title>PCB STRUCTURES IN SMT</title><author>MOLDSVOR, Oystein</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3837928A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MOLDSVOR, Oystein</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MOLDSVOR, Oystein</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PCB STRUCTURES IN SMT</title><date>2021-06-23</date><risdate>2021</risdate><abstract>A technique for creating a printed circuit board (PCB) with 3D structure entails Manufacturing a main PCB and a plurality of PCB pieces. The plurality of PCB pieces are then loaded into a tape of a tape and reel assembly, and the main PCB is processed through an assembler, wherein a tape and reel placement machine is loaded with the tape and reel assembly. The assembler processes the main PCB such that one or more of the plurality of PCB pieces is placed on and affixed to the main PCB. The tape and reel placement machine may also contain a tape loaded with other SMTs, which may be affixed to the main PC.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | PCB STRUCTURES IN SMT |
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