TWO COMPONENT (2K) CURABLE ADHESIVE COMPOSITION
The present invention is directed to a curable and debondable two-part (2K) adhesive composition comprising: i) a first part comprising: a) epoxy resin; b) an electrolyte; c) optionally, a solubilizer; and, ii) a second part comprising: a) a curing agent consisting of at least one compound possessin...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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