OVERMOULDED PRINTED ELECTRONIC PARTS AND METHODS FOR THE MANUFACTURE THEREOF

The present application relates to overmoulded printed electronic parts as well as to methods for preparing overmoulded printed electronic parts using conductive trace inks such as molecular inks, thermoset resins, and reinforcing materials such as glass microspheres and glass fabric.

Bibliographische Detailangaben

Hauptverfasser:	MOZENSON, Olga, KELL, Arnold Jason, LIU, Xiangyang, TRUDEAU, Paul Arthur
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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