COMPOSITE POLYSTYRENE FOAM MOLDING WITH LOW THERMAL CONDUCTIVITY

A composite polystyrene foam molding with low thermal conductivity comprising 15 - 50% by volume of organic nanoporous particles, and 85 -50% by volume of prefoamed styrene polymer particles as well as a process for manufacturing such composite polystyrene foam moldings by steam-chest molding.

Bibliographische Detailangaben

Hauptverfasser:	SCHERZER, Dietrich, HAVERKEMPER, Gregor, DIETZEN, Franz-Josef, BELLIN, Ingo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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