ADHESIVE COMPOSITION
The present application relates to an epoxy-based adhesive composition. The present application can provide excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable...
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| creator | KIM, Min Kyoun YU, Min A CHO, Byung Kyu LEE, Taek Yong KIM, Dong Yong KO, Min Jin JUNG, Jae Ho |
| description | The present application relates to an epoxy-based adhesive composition. The present application can provide excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION |
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