ENCAPSULATION FILM
Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsul...
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| creator | SHIN, Moon Cheol MOK, Yeong Bong RYU, Jae Seol RYU, Dong Hwan JANG, Se Hyun |
| description | Provided is an encapsulation film, an organic electronic device comprising the same, and a method for manufacturing an organic electronic device comprising the same. The encapsulation film comprises an encapsulation layer comprising a moisture adsorbent, and a metal mesh layer formed on the encapsulation layer. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | ENCAPSULATION FILM |
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