MOLDING ASSEMBLY, CAMERA MODULE, MOLDING ASSEMBLY JOINTED BOARD AND MANUFACTURING METHOD

A molded assembly, a camera module, a jointed board of molded assembly, and a manufacturing method are provided. The molded assembly includes a circuit board and a molded portion, wherein the circuit board has a molding region, a mounting region and at least two pad regions, the molding region surro...

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Bibliographische Detailangaben

Hauptverfasser:	MEI, Qimin, MEI, Zhewen, ZHAO, Bojie, HUANG, Weiwei
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PHYSICS PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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