PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM

This application provides a printed circuit board, a power supply, and a power supply system, and relates to a field of electronic communications technologies. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: CHEN, Zuyu, CHEN, Zongxun, ZHU, Qingfeng
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator CHEN, Zuyu
CHEN, Zongxun
ZHU, Qingfeng
description This application provides a printed circuit board, a power supply, and a power supply system, and relates to a field of electronic communications technologies. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer sandwiched between the first outer conducting layer and the second outer conducting layer. The printed circuit board includes a gold finger area and a soldering area. A total thickness of all conducting layers in the gold finger area is greater than a total thickness of all conducting layers in the soldering area. Because the total thickness of all conducting layers in the gold finger area is set to be relatively thick, resistance of the gold finger area can be reduced, and a through-current capability of the gold finger area is improved. In addition, the total thickness of all conducting layers in the soldering area is set to be relatively thin, so that a sufficient soldering temperature and a good soldering effect can be ensured when electronic parts and components are soldered to the soldering area.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3817521A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3817521A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3817521A43</originalsourceid><addsrcrecordid>eNrjZLAJCPL0C3F1UXD2DHIO9QxRcPJ3DHLRUQjwD3cNUggODQjwidRRcPRzQRFRCI4MDnH15WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxhaG5qZGho4mxkQoAQDFKylc</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM</title><source>esp@cenet</source><creator>CHEN, Zuyu ; CHEN, Zongxun ; ZHU, Qingfeng</creator><creatorcontrib>CHEN, Zuyu ; CHEN, Zongxun ; ZHU, Qingfeng</creatorcontrib><description>This application provides a printed circuit board, a power supply, and a power supply system, and relates to a field of electronic communications technologies. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer sandwiched between the first outer conducting layer and the second outer conducting layer. The printed circuit board includes a gold finger area and a soldering area. A total thickness of all conducting layers in the gold finger area is greater than a total thickness of all conducting layers in the soldering area. Because the total thickness of all conducting layers in the gold finger area is set to be relatively thick, resistance of the gold finger area can be reduced, and a through-current capability of the gold finger area is improved. In addition, the total thickness of all conducting layers in the soldering area is set to be relatively thin, so that a sufficient soldering temperature and a good soldering effect can be ensured when electronic parts and components are soldered to the soldering area.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211027&amp;DB=EPODOC&amp;CC=EP&amp;NR=3817521A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25566,76549</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20211027&amp;DB=EPODOC&amp;CC=EP&amp;NR=3817521A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHEN, Zuyu</creatorcontrib><creatorcontrib>CHEN, Zongxun</creatorcontrib><creatorcontrib>ZHU, Qingfeng</creatorcontrib><title>PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM</title><description>This application provides a printed circuit board, a power supply, and a power supply system, and relates to a field of electronic communications technologies. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer sandwiched between the first outer conducting layer and the second outer conducting layer. The printed circuit board includes a gold finger area and a soldering area. A total thickness of all conducting layers in the gold finger area is greater than a total thickness of all conducting layers in the soldering area. Because the total thickness of all conducting layers in the gold finger area is set to be relatively thick, resistance of the gold finger area can be reduced, and a through-current capability of the gold finger area is improved. In addition, the total thickness of all conducting layers in the soldering area is set to be relatively thin, so that a sufficient soldering temperature and a good soldering effect can be ensured when electronic parts and components are soldered to the soldering area.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLAJCPL0C3F1UXD2DHIO9QxRcPJ3DHLRUQjwD3cNUggODQjwidRRcPRzQRFRCI4MDnH15WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxhaG5qZGho4mxkQoAQDFKylc</recordid><startdate>20211027</startdate><enddate>20211027</enddate><creator>CHEN, Zuyu</creator><creator>CHEN, Zongxun</creator><creator>ZHU, Qingfeng</creator><scope>EVB</scope></search><sort><creationdate>20211027</creationdate><title>PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM</title><author>CHEN, Zuyu ; CHEN, Zongxun ; ZHU, Qingfeng</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3817521A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHEN, Zuyu</creatorcontrib><creatorcontrib>CHEN, Zongxun</creatorcontrib><creatorcontrib>ZHU, Qingfeng</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHEN, Zuyu</au><au>CHEN, Zongxun</au><au>ZHU, Qingfeng</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM</title><date>2021-10-27</date><risdate>2021</risdate><abstract>This application provides a printed circuit board, a power supply, and a power supply system, and relates to a field of electronic communications technologies. The printed circuit board includes a first outer conducting layer, a second outer conducting layer, and at least one insulation medium layer sandwiched between the first outer conducting layer and the second outer conducting layer. The printed circuit board includes a gold finger area and a soldering area. A total thickness of all conducting layers in the gold finger area is greater than a total thickness of all conducting layers in the soldering area. Because the total thickness of all conducting layers in the gold finger area is set to be relatively thick, resistance of the gold finger area can be reduced, and a through-current capability of the gold finger area is improved. In addition, the total thickness of all conducting layers in the soldering area is set to be relatively thin, so that a sufficient soldering temperature and a good soldering effect can be ensured when electronic parts and components are soldered to the soldering area.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3817521A4
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title PRINTED CIRCUIT BOARD, POWER SUPPLY, AND POWER SUPPLY SYSTEM
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-18T00%3A53%3A47IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHEN,%20Zuyu&rft.date=2021-10-27&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3817521A4%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true