POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF

The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form aesthetic injection-molded articles. The polyamide compositions may include from 45 wt. % to 75 wt. % of an polyamide, from 2 wt. % to 40 wt. % of an etcha...

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Hauptverfasser: SPARKS, Bradley James, RAY, Jacob G, WHITE, Kimberly M, POWERS, Scott E
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Sprache:eng ; fre ; ger
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creator SPARKS, Bradley James
RAY, Jacob G
WHITE, Kimberly M
POWERS, Scott E
description The present disclosure relates to polyamide compositions and resulting injection-molded articles that can be plated, e.g., metal coated, to form aesthetic injection-molded articles. The polyamide compositions may include from 45 wt. % to 75 wt. % of an polyamide, from 2 wt. % to 40 wt. % of an etchable filler, from 10 wt. % to 40 wt. % of a semi-structural mineral, and optionally from 0.1 wt. % to 13 wt. % of additive. The polyamide composition imparts very good surface appearance to injection-molded articles that are substantially free of visual defects.
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language eng ; fre ; ger
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subjects CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
COMPOSITIONS BASED THEREON
DIFFUSION TREATMENT OF METALLIC MATERIAL
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
title POLYAMIDE COMPOSITIONS AND PLATING APPLICATIONS THEREOF
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