PACKAGE STRUCTURE OF SOUND PRODUCING DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE OF SOUND PRODUCING DEVICE AND MANUFACTURING METHOD THEREOF

A package structure of a sound producing device includes a base, a cap, a chip and a chamber. The cap is disposed on the base. The chip is disposed on the base, the chip includes a thin film structure and an actuator configured to actuate the thin film structure to generate a plurality of air pulses...

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Hauptverfasser: Chen, Lei, Jiang, JengYaw, Lo, Chiung C, Hong, David, Liang, Jemm Yue
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
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creator Chen, Lei
Jiang, JengYaw
Lo, Chiung C
Hong, David
Liang, Jemm Yue
description A package structure of a sound producing device includes a base, a cap, a chip and a chamber. The cap is disposed on the base. The chip is disposed on the base, the chip includes a thin film structure and an actuator configured to actuate the thin film structure to generate a plurality of air pulses, and the cap and the chip are on a same side of the base. The chamber is formed by the base and the cap or formed by the base, the cap and the chip; the thin film structure is disposed in the chamber. One of the base or the cap has a sound outlet opening connected to the chamber, and the air pulses propagate outwards through the sound outlet opening.
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subjects DEAF-AID SETS
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS
PUBLIC ADDRESS SYSTEMS
title PACKAGE STRUCTURE OF SOUND PRODUCING DEVICE AND MANUFACTURING METHOD THEREOF
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