SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM

SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM

A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprisinga metallic cooling structure (20) with an integrated fluid channel (30) for guiding fluid within the cooling structure (20), anda distribution structure (4...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BRITTING, Stefan, MÜLLER, László, HERRMANN, Rainer, MEYER, Andreas, GIL, Vitalij
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator BRITTING, Stefan
MÜLLER, László
HERRMANN, Rainer
MEYER, Andreas
GIL, Vitalij
description A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprisinga metallic cooling structure (20) with an integrated fluid channel (30) for guiding fluid within the cooling structure (20), anda distribution structure (40) made of plastic for supplying the fluid channel (30) with the fluid,wherein the cooling structure (20) has on its outer side (A) facing the distribution structure (40) an inlet opening (31) and an outlet opening (32) separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30) and the fluid channel (30) is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening (31) in the direction of the component side (5) and is redirected within the cooling structure (20).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3794638A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3794638A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3794638A13</originalsourceid><addsrcrecordid>eNrjZMgJjgwOcfVVcPMPUnD29_fx9HNXcFTwdQ1x9NF1dg1y9PV0VggOdQoOCXIMcdXBLaXg6OcCkvPwdwGbFRDk7xLqDDIt2NHTRQFiCw8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXcNMDa3NDEztnA0NCZCCQBi-TYe</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM</title><source>esp@cenet</source><creator>BRITTING, Stefan ; MÜLLER, László ; HERRMANN, Rainer ; MEYER, Andreas ; GIL, Vitalij</creator><creatorcontrib>BRITTING, Stefan ; MÜLLER, László ; HERRMANN, Rainer ; MEYER, Andreas ; GIL, Vitalij</creatorcontrib><description>A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprisinga metallic cooling structure (20) with an integrated fluid channel (30) for guiding fluid within the cooling structure (20), anda distribution structure (40) made of plastic for supplying the fluid channel (30) with the fluid,wherein the cooling structure (20) has on its outer side (A) facing the distribution structure (40) an inlet opening (31) and an outlet opening (32) separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30) and the fluid channel (30) is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening (31) in the direction of the component side (5) and is redirected within the cooling structure (20).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210324&amp;DB=EPODOC&amp;CC=EP&amp;NR=3794638A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210324&amp;DB=EPODOC&amp;CC=EP&amp;NR=3794638A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BRITTING, Stefan</creatorcontrib><creatorcontrib>MÜLLER, László</creatorcontrib><creatorcontrib>HERRMANN, Rainer</creatorcontrib><creatorcontrib>MEYER, Andreas</creatorcontrib><creatorcontrib>GIL, Vitalij</creatorcontrib><title>SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM</title><description>A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprisinga metallic cooling structure (20) with an integrated fluid channel (30) for guiding fluid within the cooling structure (20), anda distribution structure (40) made of plastic for supplying the fluid channel (30) with the fluid,wherein the cooling structure (20) has on its outer side (A) facing the distribution structure (40) an inlet opening (31) and an outlet opening (32) separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30) and the fluid channel (30) is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening (31) in the direction of the component side (5) and is redirected within the cooling structure (20).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZMgJjgwOcfVVcPMPUnD29_fx9HNXcFTwdQ1x9NF1dg1y9PV0VggOdQoOCXIMcdXBLaXg6OcCkvPwdwGbFRDk7xLqDDIt2NHTRQFiCw8Da1piTnEqL5TmZlBwcw1x9tBNLciPTy0uSExOzUstiXcNMDa3NDEztnA0NCZCCQBi-TYe</recordid><startdate>20210324</startdate><enddate>20210324</enddate><creator>BRITTING, Stefan</creator><creator>MÜLLER, László</creator><creator>HERRMANN, Rainer</creator><creator>MEYER, Andreas</creator><creator>GIL, Vitalij</creator><scope>EVB</scope></search><sort><creationdate>20210324</creationdate><title>SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM</title><author>BRITTING, Stefan ; MÜLLER, László ; HERRMANN, Rainer ; MEYER, Andreas ; GIL, Vitalij</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3794638A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>BRITTING, Stefan</creatorcontrib><creatorcontrib>MÜLLER, László</creatorcontrib><creatorcontrib>HERRMANN, Rainer</creatorcontrib><creatorcontrib>MEYER, Andreas</creatorcontrib><creatorcontrib>GIL, Vitalij</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BRITTING, Stefan</au><au>MÜLLER, László</au><au>HERRMANN, Rainer</au><au>MEYER, Andreas</au><au>GIL, Vitalij</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM</title><date>2021-03-24</date><risdate>2021</risdate><abstract>A system for cooling a metal-ceramic substrate (1) having a component side (5) and a cooling side (6) opposite the component side (5), comprisinga metallic cooling structure (20) with an integrated fluid channel (30) for guiding fluid within the cooling structure (20), anda distribution structure (40) made of plastic for supplying the fluid channel (30) with the fluid,wherein the cooling structure (20) has on its outer side (A) facing the distribution structure (40) an inlet opening (31) and an outlet opening (32) separate from the inlet opening (31), wherein the inlet opening (31) and the outlet opening (32) are connected to each other via the fluid channel (30) and the fluid channel (30) is configured such that, when the cooling structure is installed, the fluid is guided from the inlet opening (31) in the direction of the component side (5) and is redirected within the cooling structure (20).</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3794638A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title SYSTEM FOR COOLING A METAL-CERAMIC SUBSTRATE, A METAL-CERAMIC SUBSTRATE AND METHOD FOR PRODUCING SAID SYSTEM
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T19%3A14%3A52IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=BRITTING,%20Stefan&rft.date=2021-03-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3794638A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true