MOUNTING SUBSTRATE TO WHICH IMAGE SENSOR IS MOUNTED, SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

MOUNTING SUBSTRATE TO WHICH IMAGE SENSOR IS MOUNTED, SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF

A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NAITO, Dai
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator NAITO, Dai
description A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3787026A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3787026A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3787026A13</originalsourceid><addsrcrecordid>eNqNzEEKwjAQheFuXIh6hzmAglqw3Y7JpAmSpCQTXJaicSVaqPdHKrp39eDn482Lq_XJsXENxHSMHJAJ2MNZG6HBWGwIIrnoA5gIH0ty_UstitMk0Emw6JJCwSlMZ5ZYewmsKZBXy2J26-9jXn13UYAiFnqTh2eXx6G_5Ed-ddSWVV1t9wfclX-QN_cENDU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>MOUNTING SUBSTRATE TO WHICH IMAGE SENSOR IS MOUNTED, SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF</title><source>esp@cenet</source><creator>NAITO, Dai</creator><creatorcontrib>NAITO, Dai</creatorcontrib><description>A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210303&amp;DB=EPODOC&amp;CC=EP&amp;NR=3787026A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20210303&amp;DB=EPODOC&amp;CC=EP&amp;NR=3787026A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAITO, Dai</creatorcontrib><title>MOUNTING SUBSTRATE TO WHICH IMAGE SENSOR IS MOUNTED, SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF</title><description>A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNzEEKwjAQheFuXIh6hzmAglqw3Y7JpAmSpCQTXJaicSVaqPdHKrp39eDn482Lq_XJsXENxHSMHJAJ2MNZG6HBWGwIIrnoA5gIH0ty_UstitMk0Emw6JJCwSlMZ5ZYewmsKZBXy2J26-9jXn13UYAiFnqTh2eXx6G_5Ed-ddSWVV1t9wfclX-QN_cENDU</recordid><startdate>20210303</startdate><enddate>20210303</enddate><creator>NAITO, Dai</creator><scope>EVB</scope></search><sort><creationdate>20210303</creationdate><title>MOUNTING SUBSTRATE TO WHICH IMAGE SENSOR IS MOUNTED, SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF</title><author>NAITO, Dai</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3787026A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>NAITO, Dai</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAITO, Dai</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MOUNTING SUBSTRATE TO WHICH IMAGE SENSOR IS MOUNTED, SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF</title><date>2021-03-03</date><risdate>2021</risdate><abstract>A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng ; fre ; ger
recordid cdi_epo_espacenet_EP3787026A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title MOUNTING SUBSTRATE TO WHICH IMAGE SENSOR IS MOUNTED, SENSOR PACKAGE AND MANUFACTURING METHOD THEREOF
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T15%3A46%3A40IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NAITO,%20Dai&rft.date=2021-03-03&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3787026A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true