METHOD FOR PRODUCING A SANDWICH ARRANGEMENT
The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced by melting a solder deposit arranged between th...
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| creator | SCHÄFER, Michael PELSHAW, Nadja MIRIC, Anton-Zoran LÖWER, Yvonne |
| description | The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced by melting a solder deposit arranged between the two components and connected to one of the components, on the contact surface A or D, and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being previously produced by melting a solder preform fixed to the relevant contact surface by means of an applied fixing agent consisting of a fixing agent composition and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being arranged with the free contact surface thereof facing the corresponding contact surface D or A of the as yet unconnected component. Said fixing agent composition consists of between 0 and 97 wt. % of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285°C, between 3 and 100 wt. % of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable between 30 and 180°C and (ii) non-polymer organic compounds without acid groups, which are meltable between 30 and 180°C, between 0 and 20 wt. % of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable between 30 and 180°C and (iv) non-polymer organic compounds without acid groups, which are not meltable between 30 and 180°C and do not have a boiling point or have a boiling of above 285°C, and between 0 and 30 wt. % of at least one inorganic solid filler. In the absence of at least one constituent (i) in the at least one material M1 1500 µm2, the sum of the surface portions, provided with the fixing agent, of the contact surfaces A and B or C and D forming a common overlapping surface when the solder preform is put in place, amounts to 50 surface % of the common overlapping surface, while in the sole absence of at least one constituent (ii) in the at least one material M1 1500 µm2, said sum amounts to 100 surface % of the common overlapping surface. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3762171B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3762171B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3762171B13</originalsourceid><addsrcrecordid>eNrjZND2dQ3x8HdRcPMPUggI8ncJdfb0c1dwVAh29HMJ93T2UHAMCnL0c3f1dfUL4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxuZmRobmhk6GxkQoAQAhZiRr</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING A SANDWICH ARRANGEMENT</title><source>esp@cenet</source><creator>SCHÄFER, Michael ; PELSHAW, Nadja ; MIRIC, Anton-Zoran ; LÖWER, Yvonne</creator><creatorcontrib>SCHÄFER, Michael ; PELSHAW, Nadja ; MIRIC, Anton-Zoran ; LÖWER, Yvonne</creatorcontrib><description>The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced by melting a solder deposit arranged between the two components and connected to one of the components, on the contact surface A or D, and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being previously produced by melting a solder preform fixed to the relevant contact surface by means of an applied fixing agent consisting of a fixing agent composition and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being arranged with the free contact surface thereof facing the corresponding contact surface D or A of the as yet unconnected component. Said fixing agent composition consists of between 0 and 97 wt. % of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285°C, between 3 and 100 wt. % of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable between 30 and 180°C and (ii) non-polymer organic compounds without acid groups, which are meltable between 30 and 180°C, between 0 and 20 wt. % of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable between 30 and 180°C and (iv) non-polymer organic compounds without acid groups, which are not meltable between 30 and 180°C and do not have a boiling point or have a boiling of above 285°C, and between 0 and 30 wt. % of at least one inorganic solid filler. In the absence of at least one constituent (i) in the at least one material M1 1500 µm2, the sum of the surface portions, provided with the fixing agent, of the contact surfaces A and B or C and D forming a common overlapping surface when the solder preform is put in place, amounts to 50 surface % of the common overlapping surface, while in the sole absence of at least one constituent (ii) in the at least one material M1 1500 µm2, said sum amounts to 100 surface % of the common overlapping surface.</description><language>eng ; fre ; ger</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230621&DB=EPODOC&CC=EP&NR=3762171B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230621&DB=EPODOC&CC=EP&NR=3762171B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SCHÄFER, Michael</creatorcontrib><creatorcontrib>PELSHAW, Nadja</creatorcontrib><creatorcontrib>MIRIC, Anton-Zoran</creatorcontrib><creatorcontrib>LÖWER, Yvonne</creatorcontrib><title>METHOD FOR PRODUCING A SANDWICH ARRANGEMENT</title><description>The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced by melting a solder deposit arranged between the two components and connected to one of the components, on the contact surface A or D, and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being previously produced by melting a solder preform fixed to the relevant contact surface by means of an applied fixing agent consisting of a fixing agent composition and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being arranged with the free contact surface thereof facing the corresponding contact surface D or A of the as yet unconnected component. Said fixing agent composition consists of between 0 and 97 wt. % of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285°C, between 3 and 100 wt. % of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable between 30 and 180°C and (ii) non-polymer organic compounds without acid groups, which are meltable between 30 and 180°C, between 0 and 20 wt. % of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable between 30 and 180°C and (iv) non-polymer organic compounds without acid groups, which are not meltable between 30 and 180°C and do not have a boiling point or have a boiling of above 285°C, and between 0 and 30 wt. % of at least one inorganic solid filler. In the absence of at least one constituent (i) in the at least one material M1 1500 µm2, the sum of the surface portions, provided with the fixing agent, of the contact surfaces A and B or C and D forming a common overlapping surface when the solder preform is put in place, amounts to 50 surface % of the common overlapping surface, while in the sole absence of at least one constituent (ii) in the at least one material M1 1500 µm2, said sum amounts to 100 surface % of the common overlapping surface.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND2dQ3x8HdRcPMPUggI8ncJdfb0c1dwVAh29HMJ93T2UHAMCnL0c3f1dfUL4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BxuZmRobmhk6GxkQoAQAhZiRr</recordid><startdate>20230621</startdate><enddate>20230621</enddate><creator>SCHÄFER, Michael</creator><creator>PELSHAW, Nadja</creator><creator>MIRIC, Anton-Zoran</creator><creator>LÖWER, Yvonne</creator><scope>EVB</scope></search><sort><creationdate>20230621</creationdate><title>METHOD FOR PRODUCING A SANDWICH ARRANGEMENT</title><author>SCHÄFER, Michael ; PELSHAW, Nadja ; MIRIC, Anton-Zoran ; LÖWER, Yvonne</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3762171B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SCHÄFER, Michael</creatorcontrib><creatorcontrib>PELSHAW, Nadja</creatorcontrib><creatorcontrib>MIRIC, Anton-Zoran</creatorcontrib><creatorcontrib>LÖWER, Yvonne</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SCHÄFER, Michael</au><au>PELSHAW, Nadja</au><au>MIRIC, Anton-Zoran</au><au>LÖWER, Yvonne</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING A SANDWICH ARRANGEMENT</title><date>2023-06-21</date><risdate>2023</risdate><abstract>The invention relates to a method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D, and solder between the contact surfaces A and D, the solder being produced by melting a solder deposit arranged between the two components and connected to one of the components, on the contact surface A or D, and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being previously produced by melting a solder preform fixed to the relevant contact surface by means of an applied fixing agent consisting of a fixing agent composition and subsequent cooling of the molten solder at the solidification temperature thereof, the solder deposit being arranged with the free contact surface thereof facing the corresponding contact surface D or A of the as yet unconnected component. Said fixing agent composition consists of between 0 and 97 wt. % of at least one solvent selected from the group consisting of water and organic solvents boiling at ≤ 285°C, between 3 and 100 wt. % of at least one material M1 selected from the group consisting of (i) thermoplastic organic polymers that are meltable between 30 and 180°C and (ii) non-polymer organic compounds without acid groups, which are meltable between 30 and 180°C, between 0 and 20 wt. % of at least one material M2 selected from the group consisting of (iii) organic polymers that are not meltable between 30 and 180°C and (iv) non-polymer organic compounds without acid groups, which are not meltable between 30 and 180°C and do not have a boiling point or have a boiling of above 285°C, and between 0 and 30 wt. % of at least one inorganic solid filler. In the absence of at least one constituent (i) in the at least one material M1 1500 µm2, the sum of the surface portions, provided with the fixing agent, of the contact surfaces A and B or C and D forming a common overlapping surface when the solder preform is put in place, amounts to 50 surface % of the common overlapping surface, while in the sole absence of at least one constituent (ii) in the at least one material M1 1500 µm2, said sum amounts to 100 surface % of the common overlapping surface.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD FOR PRODUCING A SANDWICH ARRANGEMENT |
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