SYSTEM AND METHOD FOR ENHANCEMENT OF LASER MATERIAL PROCESSING VIA MODULATION OF LASER LIGHT INTENSITY
The present disclosure relates to a laser-based system and method for providing efficient melt removal of material from a surface of a material sample being acted on in a laser machining operation. In one implementation the system may make use of a continuous wave (CW) laser for generating a laser b...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present disclosure relates to a laser-based system and method for providing efficient melt removal of material from a surface of a material sample being acted on in a laser machining operation. In one implementation the system may make use of a continuous wave (CW) laser for generating a laser beam directed at a spot on the surface of the material sample. The CW laser may be configured to be modulated at a predetermined frequency such that the laser beam excites and amplifies surface capillary waves on the surface of the sample up to a melt ejection point, which ejects molten material from the spot being acted on by the laser beam, to more rapidly facilitate material removal from the spot. |
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