CHIPLET FIRST ARCHITECTURE FOR DIE TILING APPLICATIONS

Embodiments disclosed herein include electronic packages and methods of forming such electronic packages. In an embodiment, the electronic package comprises a mold layer having a first surface and a second surface opposite the first surface, and a plurality of first dies embedded in the mold layer....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KULKARNI, Deepak, DUAN, Gang, PIETAMBARAM, Srinivas V, MANEPALLI, Rahul N, GUO, Xiaoying
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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