HEAT-SEAL LID AND CAN

A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the meta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IWAKIRI, Kazushi, MIZUTANI, Tomohiro, KATO, Satoshi, KADOWAKI, Nobuo
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS CONVEYING HANDLING THIN OR FILAMENTARY MATERIAL LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PACKAGES PACKAGING ELEMENTS PACKING PERFORMING OPERATIONS STORING TRANSPORTING
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Beschreibung
Zusammenfassung:	A heat sealed lid includes: a resin laminate aluminum foil; and a first seamed side frame portion and a second seamed side frame portion formed of a resin film laminate metal sheet, in which the resin film laminate metal sheet includes a metal sheet, a laminate film formed on one surface of the metal sheet, and a second resin film formed on the other surface of the metal sheet and containing a thermoplastic polyester resin, the laminate film includes an adhesion layer containing a polypropylene-based resin and a polyethylene-based resin and a base layer containing a modified polypropylene-based resin, an amount of the polyethylene-based resin in the adhesion layer is 1.0 mass% or more and 45.0 mass% or less of the resins of the adhesion layer, the melting point of the second resin film is higher than the melting point of the adhesion layer by 40°C or more and is higher than the heating temperature of a heat sealing tool, the thickness of the adhesion layer is 1.0 µm or more and 15.0 µm or less, and the thickness of the base layer is 1.0 µm or more and 18.0 µm or less.