METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS

METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS

Methods for reducing wafer bow induced by an anti -reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an...

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Hauptverfasser: KOCIAN, Thomas A, KENNEDY, Adam M, GOOCH, Roland W, BLACK, Stephen H, DIEP, Buu Q
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Sprache:eng ; fre ; ger
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MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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creator KOCIAN, Thomas A
KENNEDY, Adam M
GOOCH, Roland W
BLACK, Stephen H
DIEP, Buu Q
description Methods for reducing wafer bow induced by an anti -reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP3696138A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP3696138A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP3696138A13</originalsourceid><addsrcrecordid>eNqNirEKwkAQBdNYiPoP-wMpQiBouVzemsMzF_YOxSoEOSvRSPx_DOgHWM0wzDJ7HREbX5MXClERAimchZBtidtoc4U4mGhPIOM5oibDHZ1ZoIHE61fJ4QRHHZsD7-fHtqKss4g3PHfHLYhV-RLW2eI23Ke0-XGVkSCaJk_js0_TOFzTI717dGW1q4pyy0X5x_IBRCg3FA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS</title><source>esp@cenet</source><creator>KOCIAN, Thomas A ; KENNEDY, Adam M ; GOOCH, Roland W ; BLACK, Stephen H ; DIEP, Buu Q</creator><creatorcontrib>KOCIAN, Thomas A ; KENNEDY, Adam M ; GOOCH, Roland W ; BLACK, Stephen H ; DIEP, Buu Q</creatorcontrib><description>Methods for reducing wafer bow induced by an anti -reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.</description><language>eng ; fre ; ger</language><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES ; MICROSTRUCTURAL TECHNOLOGY ; PERFORMING OPERATIONS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200819&amp;DB=EPODOC&amp;CC=EP&amp;NR=3696138A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200819&amp;DB=EPODOC&amp;CC=EP&amp;NR=3696138A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KOCIAN, Thomas A</creatorcontrib><creatorcontrib>KENNEDY, Adam M</creatorcontrib><creatorcontrib>GOOCH, Roland W</creatorcontrib><creatorcontrib>BLACK, Stephen H</creatorcontrib><creatorcontrib>DIEP, Buu Q</creatorcontrib><title>METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS</title><description>Methods for reducing wafer bow induced by an anti -reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.</description><subject>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNirEKwkAQBdNYiPoP-wMpQiBouVzemsMzF_YOxSoEOSvRSPx_DOgHWM0wzDJ7HREbX5MXClERAimchZBtidtoc4U4mGhPIOM5oibDHZ1ZoIHE61fJ4QRHHZsD7-fHtqKss4g3PHfHLYhV-RLW2eI23Ke0-XGVkSCaJk_js0_TOFzTI717dGW1q4pyy0X5x_IBRCg3FA</recordid><startdate>20200819</startdate><enddate>20200819</enddate><creator>KOCIAN, Thomas A</creator><creator>KENNEDY, Adam M</creator><creator>GOOCH, Roland W</creator><creator>BLACK, Stephen H</creator><creator>DIEP, Buu Q</creator><scope>EVB</scope></search><sort><creationdate>20200819</creationdate><title>METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS</title><author>KOCIAN, Thomas A ; KENNEDY, Adam M ; GOOCH, Roland W ; BLACK, Stephen H ; DIEP, Buu Q</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP3696138A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KOCIAN, Thomas A</creatorcontrib><creatorcontrib>KENNEDY, Adam M</creatorcontrib><creatorcontrib>GOOCH, Roland W</creatorcontrib><creatorcontrib>BLACK, Stephen H</creatorcontrib><creatorcontrib>DIEP, Buu Q</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KOCIAN, Thomas A</au><au>KENNEDY, Adam M</au><au>GOOCH, Roland W</au><au>BLACK, Stephen H</au><au>DIEP, Buu Q</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS</title><date>2020-08-19</date><risdate>2020</risdate><abstract>Methods for reducing wafer bow induced by an anti -reflective coating of a cap wafer are provided. The method may utilize a shadow mask having at least one opening therein that is positioned opposite recessed regions in a cap wafer. The method may further include depositing at least one layer of an anti-reflective coating material through the shadow mask onto a planar side of a cap wafer to provide a discontinuous coating on the planar side.</abstract><oa>free_for_read</oa></addata></record>
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subjects MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
title METHOD OF STRESS RELIEF IN ANTI-REFLECTIVE COATED CAP WAFERS FOR WAFER LEVEL PACKAGED INFRARED FOCAL PLANE ARRAYS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T17%3A35%3A36IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KOCIAN,%20Thomas%20A&rft.date=2020-08-19&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP3696138A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true