CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer.
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| creator | HAYASHI, Tomoki KOBAYASHI, Miyuki YAMASAKI, Kenpei TAMAKI, Tatsuya OKUNAGA, Takeshi |
| description | A circuit board according to the present invention includes: a first layer containing a fiber base material, and fusible fluororesin with which the fiber base material is impregnated; and second layers containing non-fusible fluororesin that are arranged on the two surfaces of the first layer. |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES TRANSPORTING |
| title | CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR |
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